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8460.40.80.20/Handheld Wafer Surface Lapper/China

Handheld Wafer Surface Lapper from China

Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.

Duty Rate — China → United States

41.9%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Classify as machine, not hand tool (8205)

Handheld Wafer Surface Lapper from China — Import Duty Rate | HTS 8460.40.80.20