Handheld Wafer Surface Lapper from Canada
Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Classify as machine, not hand tool (8205)