8460.40.80.20/Entry-Level Wafer Edge Grinder/Mexico

Entry-Level Wafer Edge Grinder from Mexico

Budget grinder for chamfering and edge finishing of semiconductor wafers to prevent chipping during handling. Under HTS 8460.40.80.20 for low-value grinding machines finishing silicon (cermet equivalent). Part of wafer preparation per statistical notes.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Provide wafer diameter specs (e.g

• 200mm/300mm) to confirm semiconductor use

• Declare as 'non-CNC' to stay in 'other' category

• Watch for anti-dumping duties on Asian-origin grinders