Entry-Level Wafer Edge Grinder from Japan
Budget grinder for chamfering and edge finishing of semiconductor wafers to prevent chipping during handling. Under HTS 8460.40.80.20 for low-value grinding machines finishing silicon (cermet equivalent). Part of wafer preparation per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide wafer diameter specs (e.g
• 200mm/300mm) to confirm semiconductor use
• Declare as 'non-CNC' to stay in 'other' category
• Watch for anti-dumping duties on Asian-origin grinders