Entry-Level Wafer Edge Grinder from Canada
Budget grinder for chamfering and edge finishing of semiconductor wafers to prevent chipping during handling. Under HTS 8460.40.80.20 for low-value grinding machines finishing silicon (cermet equivalent). Part of wafer preparation per statistical notes.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wafer diameter specs (e.g
• 200mm/300mm) to confirm semiconductor use
• Declare as 'non-CNC' to stay in 'other' category
• Watch for anti-dumping duties on Asian-origin grinders