Compact Lapping Plate Polisher from Mexico
Machine with lapping plates for simultaneous polishing of multiple small semiconductor wafers or cermet substrates. HTS 8460.40.80.20 for low-value lapping/polishing equipment using abrasives on metals/cermets.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include lapping slurry compatibility details for classification support
• Separate diamond abrasives; they classify under Chapter 71 or 82
• Use ISF for advance filing due to high-tech nature