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8460.40.80.20/Compact Lapping Plate Polisher/Japan

Compact Lapping Plate Polisher from Japan

Machine with lapping plates for simultaneous polishing of multiple small semiconductor wafers or cermet substrates. HTS 8460.40.80.20 for low-value lapping/polishing equipment using abrasives on metals/cermets.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include lapping slurry compatibility details for classification support

• Separate diamond abrasives; they classify under Chapter 71 or 82

• Use ISF for advance filing due to high-tech nature

Compact Lapping Plate Polisher from Japan — Import Duty Rate | HTS 8460.40.80.20