Compact Lapping Plate Polisher from Germany
Machine with lapping plates for simultaneous polishing of multiple small semiconductor wafers or cermet substrates. HTS 8460.40.80.20 for low-value lapping/polishing equipment using abrasives on metals/cermets.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include lapping slurry compatibility details for classification support
• Separate diamond abrasives; they classify under Chapter 71 or 82
• Use ISF for advance filing due to high-tech nature