Benchtop Wafer Lapping Machine from Mexico
A compact machine designed for precision lapping of semiconductor wafers to achieve exact flatness tolerances prior to fabrication processes. It falls under HTS 8460.40.80.20 as a lapping machine for finishing metal or cermets (silicon wafers qualify as cermet-like materials in semiconductor context), valued under $3,025 each. Used in wafer preparation equipment per statistical notes.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify machine value with invoice; must be under $3,025 per unit to qualify for this subheading
• Provide technical specs confirming use for lapping semiconductor wafers or metal surfaces to avoid misclassification
• Include end-use statement for semiconductor manufacturing to support Chapter 84 classification over Chapter 90 testing apparatus