Used Strasbaugh 7AA Wafer Polisher from Mexico
Used chemical-mechanical planarization (CMP) polisher for semiconductor wafers, though mechanically classified as lapping/polishing via abrasives. HTS 8460.40.8010 for used machines finishing cermet wafers. Provides global planarization essential for multi-layer device fabrication.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish mechanical from full CMP (wet process) in descriptions to prevent 8424 classification
• Include chemical resistance ratings for platen materials