Used Strasbaugh 7AA Wafer Polisher from Japan
Used chemical-mechanical planarization (CMP) polisher for semiconductor wafers, though mechanically classified as lapping/polishing via abrasives. HTS 8460.40.8010 for used machines finishing cermet wafers. Provides global planarization essential for multi-layer device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Distinguish mechanical from full CMP (wet process) in descriptions to prevent 8424 classification
• Include chemical resistance ratings for platen materials