Used Strasbaugh 7AA Wafer Polisher from Japan
Used chemical-mechanical planarization (CMP) polisher for semiconductor wafers, though mechanically classified as lapping/polishing via abrasives. HTS 8460.40.8010 for used machines finishing cermet wafers. Provides global planarization essential for multi-layer device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish mechanical from full CMP (wet process) in descriptions to prevent 8424 classification
• Include chemical resistance ratings for platen materials