Used Strasbaugh 7AA Wafer Polisher from Japan

Used chemical-mechanical planarization (CMP) polisher for semiconductor wafers, though mechanically classified as lapping/polishing via abrasives. HTS 8460.40.8010 for used machines finishing cermet wafers. Provides global planarization essential for multi-layer device fabrication.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Distinguish mechanical from full CMP (wet process) in descriptions to prevent 8424 classification

Include chemical resistance ratings for platen materials