Used Okamoto ACC-322DX Lapping Machine from Mexico
A rebuilt horizontal lapping machine designed for finishing flat semiconductor wafers to precise tolerances using abrasive slurries. It falls under HTS 8460.40.8010 as a used or rebuilt lapping machine for metal or cermets, specifically applied in wafer preparation for semiconductor fabrication. The machine ensures wafer flatness critical for subsequent processing steps.
Duty Rate — Mexico → United States
Rate breakdown
Import Tips
• Verify rebuild certification and maintenance logs to prove compliance with 'used or rebuilt' classification; original manufacturer specs required
• Include detailed condition reports and prior usage history to avoid misclassification as new equipment under 8460.40.40
• Ensure EPA and RoHS compliance for imported refurbished machinery; common pitfall is incomplete serial number tracing