8460.40.80.10/Used Okamoto ACC-322DX Lapping Machine/Mexico

Used Okamoto ACC-322DX Lapping Machine from Mexico

A rebuilt horizontal lapping machine designed for finishing flat semiconductor wafers to precise tolerances using abrasive slurries. It falls under HTS 8460.40.8010 as a used or rebuilt lapping machine for metal or cermets, specifically applied in wafer preparation for semiconductor fabrication. The machine ensures wafer flatness critical for subsequent processing steps.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Verify rebuild certification and maintenance logs to prove compliance with 'used or rebuilt' classification; original manufacturer specs required

• Include detailed condition reports and prior usage history to avoid misclassification as new equipment under 8460.40.40

• Ensure EPA and RoHS compliance for imported refurbished machinery; common pitfall is incomplete serial number tracing

Used Okamoto ACC-322DX Lapping Machine from Mexico — Import Duty Rate | HTS 8460.40.80.10