8460.40.80.10/Used Okamoto ACC-322DX Lapping Machine/Germany

Used Okamoto ACC-322DX Lapping Machine from Germany

A rebuilt horizontal lapping machine designed for finishing flat semiconductor wafers to precise tolerances using abrasive slurries. It falls under HTS 8460.40.8010 as a used or rebuilt lapping machine for metal or cermets, specifically applied in wafer preparation for semiconductor fabrication. The machine ensures wafer flatness critical for subsequent processing steps.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Verify rebuild certification and maintenance logs to prove compliance with 'used or rebuilt' classification; original manufacturer specs required

• Include detailed condition reports and prior usage history to avoid misclassification as new equipment under 8460.40.40

• Ensure EPA and RoHS compliance for imported refurbished machinery; common pitfall is incomplete serial number tracing