Used Moore Machine Tool Nanometer Lapper from Japan
Used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. HTS 8460.40.8010 classification for used lapping of precision metal/cermet parts. Features active thermal control for consistent polishing results.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Calibration certificates from accredited labs required for metrology claims
• Document software versions; export controls apply to advanced process controls