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8460.40.80.10/Used Moore Machine Tool Nanometer Lapper/Japan

Used Moore Machine Tool Nanometer Lapper from Japan

Used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. HTS 8460.40.8010 classification for used lapping of precision metal/cermet parts. Features active thermal control for consistent polishing results.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Calibration certificates from accredited labs required for metrology claims

• Document software versions; export controls apply to advanced process controls

Used Moore Machine Tool Nanometer Lapper from Japan — Import Duty Rate | HTS 8460.40.80.10