Used Moore Machine Tool Nanometer Lapper from Germany
Used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. HTS 8460.40.8010 classification for used lapping of precision metal/cermet parts. Features active thermal control for consistent polishing results.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Calibration certificates from accredited labs required for metrology claims
• Document software versions; export controls apply to advanced process controls