Used Moore Machine Tool Nanometer Lapper from Canada
Used advanced lapping machine achieving nanometer-level wafer flatness for leading-edge semiconductor production. HTS 8460.40.8010 classification for used lapping of precision metal/cermet parts. Features active thermal control for consistent polishing results.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Calibration certificates from accredited labs required for metrology claims
• Document software versions; export controls apply to advanced process controls