Rebuilt Engis Hyprez Lapping Machine from Japan
Rebuilt precision lapping system for finishing semiconductor substrates including silicon carbide wafers using electrolytic abrasives. Under HTS 8460.40.8010 as rebuilt lapping machine for hard cermet materials. Achieves damage-free surfaces for power semiconductor applications.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify substrate materials handled (Si, GaAs, SiC) in import declarations
• Electrical safety certifications mandatory for rebuilt electrolytic equipment
• Watch for reclassification when imported with power supplies as complete set