Rebuilt Engis Hyprez Lapping Machine from Japan
Rebuilt precision lapping system for finishing semiconductor substrates including silicon carbide wafers using electrolytic abrasives. Under HTS 8460.40.8010 as rebuilt lapping machine for hard cermet materials. Achieves damage-free surfaces for power semiconductor applications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify substrate materials handled (Si, GaAs, SiC) in import declarations
• Electrical safety certifications mandatory for rebuilt electrolytic equipment
• Watch for reclassification when imported with power supplies as complete set