Struers LaboForce-5 CNC Lapping Unit from Japan
Compact numerically controlled lapping machine for metallographic sample preparation and small semiconductor wafer finishing. Provides automated control of lapping parameters for consistent surface flatness. Classified in HTS 8460.40.40.60 as other numerically controlled lapping machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Highlight metallographic lab use in documentation to avoid semiconductor reclassification; Include platen size and material specs; Verify numerical control meets US customs CNC definition