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8460.40.40.60/Okamoto CNC Double-Sided Lapping Machine DLS-1200/Germany

Okamoto CNC Double-Sided Lapping Machine DLS-1200 from Germany

Numerically controlled double-sided lapping system for simultaneous finishing of both wafer surfaces to nanometer flatness. Specifically used in semiconductor wafer preparation after slicing to meet strict dimensional tolerances. Falls under HTS 8460.40.40.60 as other numerically controlled lapping machines for metal surfaces.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Provide wafer processing specifications and flatness capability data; Include abrasive slurry system details in technical documentation; Watch for reclassification risk if wafer-specific features dominate

Okamoto CNC Double-Sided Lapping Machine DLS-1200 from Germany — Import Duty Rate | HTS 8460.40.40.60