Okamoto CNC Double-Sided Lapping Machine DLS-1200 from China
Numerically controlled double-sided lapping system for simultaneous finishing of both wafer surfaces to nanometer flatness. Specifically used in semiconductor wafer preparation after slicing to meet strict dimensional tolerances. Falls under HTS 8460.40.40.60 as other numerically controlled lapping machines for metal surfaces.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide wafer processing specifications and flatness capability data; Include abrasive slurry system details in technical documentation; Watch for reclassification risk if wafer-specific features dominate