Okamoto CNC Double-Sided Lapping Machine DLS-1200 from Canada
Numerically controlled double-sided lapping system for simultaneous finishing of both wafer surfaces to nanometer flatness. Specifically used in semiconductor wafer preparation after slicing to meet strict dimensional tolerances. Falls under HTS 8460.40.40.60 as other numerically controlled lapping machines for metal surfaces.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide wafer processing specifications and flatness capability data; Include abrasive slurry system details in technical documentation; Watch for reclassification risk if wafer-specific features dominate