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Kemet CNC Lapping-Polishing Centre 48 from Japan

Numerically controlled flat lapping and polishing centre for semiconductor wafers, automotive components, and precision optics. Features 3-axis CNC control and automatic slurry dispensing. HTS 8460.40.40.60 classification for numerically controlled lapping machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Balance documentation between general metalworking and semiconductor applications; Specify CNC axis control details; Include consumable compatibility information