Kemet CNC Lapping-Polishing Centre 48 from Japan
Numerically controlled flat lapping and polishing centre for semiconductor wafers, automotive components, and precision optics. Features 3-axis CNC control and automatic slurry dispensing. HTS 8460.40.40.60 classification for numerically controlled lapping machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Balance documentation between general metalworking and semiconductor applications; Specify CNC axis control details; Include consumable compatibility information