Used Engis Hyprez Lapping System from Japan
Used numerically controlled lapping system with diamond compound delivery for finishing semiconductor test sockets and metal probe cards. HTS 8460.40.40.10 as used NC metal finishing lapping machine.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Classify based on primary metal finishing function, not semiconductor end-use
• Include slurry system specs confirming abrasive polishing method
• Avoid parts classification if fully assembled and functional