8460.40.40.10/Used Engis Hyprez Lapping System/Japan

Used Engis Hyprez Lapping System from Japan

Used numerically controlled lapping system with diamond compound delivery for finishing semiconductor test sockets and metal probe cards. HTS 8460.40.40.10 as used NC metal finishing lapping machine.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Classify based on primary metal finishing function, not semiconductor end-use

• Include slurry system specs confirming abrasive polishing method

• Avoid parts classification if fully assembled and functional