Cermet Polishing Machine for Semiconductor Tools from Japan
Machine using polishing products to finish cermet semiconductor processing tools like plasma etch blades. HTS 8460.39.0050 includes such finishing for cermets in semiconductor contexts. Achieves mirror finishes for contamination-free operation.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify cermet-specific abrasives and nanoscale polishing capabilities
• Use semiconductor end-user letters for binding rulings