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8460.39.00.50/Cermet Polishing Machine for Semiconductor Tools/Japan

Cermet Polishing Machine for Semiconductor Tools from Japan

Machine using polishing products to finish cermet semiconductor processing tools like plasma etch blades. HTS 8460.39.0050 includes such finishing for cermets in semiconductor contexts. Achieves mirror finishes for contamination-free operation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Certify cermet-specific abrasives and nanoscale polishing capabilities

• Use semiconductor end-user letters for binding rulings

Cermet Polishing Machine for Semiconductor Tools from Japan — Import Duty Rate | HTS 8460.39.00.50