Centerless Grinder

Automated machine for high-volume grinding of cylindrical metal parts without centers or chucks, used for bars and tubes. Classified in HTS 8460.29.01 as other grinding machine for metal surface finishing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
๐Ÿ‡จ๐Ÿ‡ณChina4.4%+35.0%39.4%
๐Ÿ‡ฒ๐Ÿ‡ฝMexico4.4%+10.0%14.4%
๐Ÿ‡จ๐Ÿ‡ฆCanada4.4%+10.0%14.4%
๐Ÿ‡ฉ๐Ÿ‡ชGermany4.4%+10.0%14.4%
๐Ÿ‡ฏ๐Ÿ‡ตJapan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460Same rate: 39.4%

If CNC controlled

Numerical control variants have dedicated tariff lines.

8479.89Lower: 12.5% vs 39.4%

If for semiconductor wafer grinding applications

Specialized wafer grinders for semiconductor processing fall under Chapter 84 semiconductor provisions.

8462.29.00Same rate: 39.4%

If configured for bending rather than grinding

Machines with dual functions may classify based on principal function.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

โ€ข Include regulating wheel and grinding wheel specifications in technical files

โ€ข Ensure end-use statement specifies metal bar stock grinding, not semiconductor wafers