Nano-Precision Internal Bore Grinder from Japan
Ultra-precision grinder achieving sub-micron tolerances on internal cylindrical bores for metal shafts in semiconductor wafer probers. HTS 8460.29.0130 covers other internal cylindrical metal grinders.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide roundness/taper specs (<0.5 micron) confirming nano-precision classification
• Temperature-controlled enclosure value included; climate affects performance claims
• ITAR/EAR compliance critical for sub-micron metalworking machines