Nano-Precision Internal Bore Grinder from Japan
Ultra-precision grinder achieving sub-micron tolerances on internal cylindrical bores for metal shafts in semiconductor wafer probers. HTS 8460.29.0130 covers other internal cylindrical metal grinders.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide roundness/taper specs (<0.5 micron) confirming nano-precision classification
• Temperature-controlled enclosure value included; climate affects performance claims
• ITAR/EAR compliance critical for sub-micron metalworking machines