Haas CNC Centerless Grinder CL-1
The Haas CNC Centerless Grinder CL-1 is a numerically controlled machine tool designed for precision grinding of cylindrical metal parts such as shafts and bars without using centers. It employs abrasive wheels to remove material and achieve tight tolerances on outer diameters, classifying it under HTS 8460.22.00.80 as a centerless grinding machine, numerically controlled, other than gear-specific. This equipment is essential in semiconductor manufacturing for preparing metal components used in wafer processing tools.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not numerically controlled
Non-NC centerless grinders fall under the broader 'other grinding machines' without numerical control specification.
If imported as parts for semiconductor equipment
Components or accessories for semiconductor processing machines are classified in Chapter 84 under specific provisions rather than complete machine tools.
If specialized for semiconductor wafer boule grinding
Machines for crystal boule grinding in semiconductor manufacturing are covered under statistical notes for semiconductor equipment in 8479.
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Import Tips & Compliance
• Verify CNC control features meet 'numerically controlled' criteria with manufacturer specs; ensure machine calibration certificates for customs valuation
• Common pitfall: misclassifying as non-NC under 8460.22.00.90, leading to duty disputes
Related Products under HTS 8460.22.00.80
Cincinnati Milacron Centerless Grinder 3500-CNC
The Cincinnati Milacron 3500-CNC is a high-precision, numerically controlled centerless grinding machine optimized for finishing hard metal rods and tubes used in precision industries. It uses abrasive belts and wheels for through-feed and in-feed grinding operations on cermets and metals, fitting HTS 8460.22.00.80 as other numerically controlled centerless grinders. Ideal for producing components for semiconductor testing apparatus.
Koyo Machinery Centerless Grinder G-20S-CNC
Koyo G-20S-CNC is a compact numerically controlled centerless grinder for small-diameter metal pins and semiconductor tooling shafts, achieving micron-level surface finishes via abrasive grinding. It supports high-volume production without fixturing centers, directly matching HTS 8460.22.00.80 for other NC centerless grinding machines. Used in processing metal parts for wafer slicers and polishers.
Toyoda CNC Centerless Grinder AAR-50150
Toyoda AAR-50150 is a numerically controlled centerless grinding machine for large metal and cermet workpieces, featuring advanced hydrostatic guides for ultra-precise finishing in semiconductor equipment manufacturing. It grinds outer diameters using regulating and grinding wheels, classified under HTS 8460.22.00.80 as other NC centerless grinders. Critical for high-tolerance shafts in wafer handling systems.
Schütte NC Centerless Grinder SU50-CNC
Schütte SU50-CNC centerless grinder is numerically controlled for finishing small precision metal components like semiconductor probe pins using abrasive polishing products. Its compact design supports infeed grinding for tight tolerances, fitting HTS 8460.22.00.80 for other centerless NC machines. Essential for metal parts in testing apparatus.
Palmary PLG-12S CNC Centerless Grinder
Palmary PLG-12S is a numerically controlled centerless grinder for small metal bars and cermet rods, delivering mirror finishes via diamond abrasives for semiconductor industry applications. It operates without workpiece centers for efficient production, classified in HTS 8460.22.00.80 as other NC centerless grinding machines.
TGS Centerless Grinder TC-9NC
TGS TC-9NC is a numerically controlled centerless grinding machine for finishing metal shafts used in semiconductor crystal pullers, employing grinding stones for surface integrity. Classified under HTS 8460.22.00.80 for other NC centerless grinders, it excels in high-precision, non-gear applications.