Surface Grinding Machine with Wafer Preparation Kit from Japan
Standard flat surface grinder equipped with vacuum chuck and thin wafer handling fixtures for semiconductor wafer backgrinding. Capable of general metal grinding but marketed for wafer thinning. HTS 8460.19.01 applies unless proven semiconductor-specific per notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• ,Include vacuum pump specifications as potential separate HTS entry
• End-use statements must balance semiconductor capability with general metalworking capacity