Surface Grinding Machine with Wafer Preparation Kit from Germany
Standard flat surface grinder equipped with vacuum chuck and thin wafer handling fixtures for semiconductor wafer backgrinding. Capable of general metal grinding but marketed for wafer thinning. HTS 8460.19.01 applies unless proven semiconductor-specific per notes.
Duty Rate — Germany → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• ,Include vacuum pump specifications as potential separate HTS entry
• End-use statements must balance semiconductor capability with general metalworking capacity