Surface Grinding Machine with Wafer Preparation Kit from Germany
Standard flat surface grinder equipped with vacuum chuck and thin wafer handling fixtures for semiconductor wafer backgrinding. Capable of general metal grinding but marketed for wafer thinning. HTS 8460.19.01 applies unless proven semiconductor-specific per notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• ,Include vacuum pump specifications as potential separate HTS entry
• End-use statements must balance semiconductor capability with general metalworking capacity