Haas NGC 40 CNC Flat Surface Grinder from Japan
A numerically controlled flat-surface grinding machine designed for precision finishing of metal and cermet surfaces using abrasive wheels. It features automatic tool changers and high-speed spindles for semiconductor wafer processing preparation. Classified under 8460.12.00.80 as a CNC flat-surface grinder for metal finishing, distinct from gear-specific machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify CNC control certification and CE marking for EU compliance before import
• Include detailed machine specifications and end-use declarations to avoid reclassification as semiconductor testing equipment under Chapter 90
• Ensure proper alignment with statistical note definitions for wafer preparation grinders to qualify for correct duty rates