Laser PCB Depaneling Machine from China
This machine uses a CO2 or fiber laser to precisely cut individual printed circuit boards from production panels without mechanical stress. It is classified under HTS 8456.11.70.00 because it is designed solely for the manufacture of printed circuit assemblies by removing material via laser processes. Ideal for high-volume electronics production.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify machine specifications confirm exclusive use for PCB manufacturing to qualify under this subheading; general-purpose lasers fall elsewhere
• Include detailed technical datasheets and end-user statements in documentation to prove 'solely or principally' for printed circuits
• Ensure laser safety certifications (e.g
• FDA Class IV compliance) and CE marking for smooth customs clearance