Laser PCB Depaneling Machine from Canada
This machine uses a CO2 or fiber laser to precisely cut individual printed circuit boards from production panels without mechanical stress. It is classified under HTS 8456.11.70.00 because it is designed solely for the manufacture of printed circuit assemblies by removing material via laser processes. Ideal for high-volume electronics production.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify machine specifications confirm exclusive use for PCB manufacturing to qualify under this subheading; general-purpose lasers fall elsewhere
• Include detailed technical datasheets and end-user statements in documentation to prove 'solely or principally' for printed circuits
• Ensure laser safety certifications (e.g
• FDA Class IV compliance) and CE marking for smooth customs clearance