Fiber Laser PCB Singulation Tool from Japan
Compact fiber laser station for singulating flex circuits and rigid-flex PCBs with minimal heat-affected zones. Falls under HTS 8456.11.70.00 due to its principal use in printed circuit assembly production via laser ablation. Features automated vision alignment for precision.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include video demos or sample cut data proving PCB-specific application during customs valuation
• Label power supply and chiller units clearly as dedicated accessories to avoid separate classification
• Watch for reclassification if software allows general material cutting beyond electronics substrates