Fiber Laser PCB Singulation Tool from Japan
Compact fiber laser station for singulating flex circuits and rigid-flex PCBs with minimal heat-affected zones. Falls under HTS 8456.11.70.00 due to its principal use in printed circuit assembly production via laser ablation. Features automated vision alignment for precision.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include video demos or sample cut data proving PCB-specific application during customs valuation
• Label power supply and chiller units clearly as dedicated accessories to avoid separate classification
• Watch for reclassification if software allows general material cutting beyond electronics substrates