CO2 Laser PCB Panel Separator from Japan
Industrial CO2 laser for clean separation of high-layer-count PCB panels in volume production. HTS 8456.11.70.00 due to exclusive use in printed circuit manufacturing via laser cutting processes. Handles panels up to 24x24 inches.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wavelength (10.6μm) optimal for PCB substrates to distinguish from metalworking CO2 lasers
• Include exhaust system specs as integral for polymer fume handling in PCB applications
• Document production throughput metrics proving principal use for printed circuit assemblies