Silicon Wafer Slicing Saw Support Roll from Japan
Cast steel support roll for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. Classified in HTS 8455.30.0035 for cast steel rolling mill rolls ≤2,268 kg, stabilizing the boule during high-precision slicing operations. Ensures flatness and minimal kerf loss.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide saw blade compatibility data to link roll to wafer slicing process
• Inspect for balance certification; imbalanced rolls cause vibration issues at customs
• Use HTSUS advisory rulings for hybrid saw/rolling functions