Silicon Wafer Slicing Saw Support Roll from Japan
Cast steel support roll for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. Classified in HTS 8455.30.0035 for cast steel rolling mill rolls ≤2,268 kg, stabilizing the boule during high-precision slicing operations. Ensures flatness and minimal kerf loss.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide saw blade compatibility data to link roll to wafer slicing process
• Inspect for balance certification; imbalanced rolls cause vibration issues at customs
• Use HTSUS advisory rulings for hybrid saw/rolling functions