Semiconductor Wafer boule Grinder Roll from Japan
Precision cast steel roll for crystal grinders that shape semiconductor boules to exact diameters for wafer production. Under HTS 8455.30.0035 as a cast steel rolling mill roll not exceeding 2,268 kg, critical for grinding flats indicating conductivity type. Maintains tight tolerances essential for downstream wafer slicing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit surface finish specs (e.g
• Ra values) proving suitability for semiconductor grinding
• Comply with REACH for steel alloys; test for heavy metals common in casting
• Pair with boule processing equipment docs to prevent standalone part reclassification