Semiconductor Wafer boule Grinder Roll from Japan
Precision cast steel roll for crystal grinders that shape semiconductor boules to exact diameters for wafer production. Under HTS 8455.30.0035 as a cast steel rolling mill roll not exceeding 2,268 kg, critical for grinding flats indicating conductivity type. Maintains tight tolerances essential for downstream wafer slicing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit surface finish specs (e.g
• Ra values) proving suitability for semiconductor grinding
• Comply with REACH for steel alloys; test for heavy metals common in casting
• Pair with boule processing equipment docs to prevent standalone part reclassification