Wafer Slicing Diamond Saw from Japan
Precision diamond wire saw for slicing semiconductor wafers from silicon boules, functioning as auxiliary equipment for crystal growing machines of heading 8444. Falls under HTS 8448.20.50.90 as parts suitable solely for wafer preparation in semiconductor manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide detailed wafer thickness specifications (typically 100-775 microns) to confirm semiconductor use
• Include boule diameter compatibility data matching heading 8444 equipment standards
• Avoid common pitfall of classifying as general cutting tools under 8461