Wafer Slicing Diamond Saw from Germany
Precision diamond wire saw for slicing semiconductor wafers from silicon boules, functioning as auxiliary equipment for crystal growing machines of heading 8444. Falls under HTS 8448.20.50.90 as parts suitable solely for wafer preparation in semiconductor manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide detailed wafer thickness specifications (typically 100-775 microns) to confirm semiconductor use
• Include boule diameter compatibility data matching heading 8444 equipment standards
• Avoid common pitfall of classifying as general cutting tools under 8461