Wafer Slicing Diamond Saw from China
Precision diamond wire saw for slicing semiconductor wafers from silicon boules, functioning as auxiliary equipment for crystal growing machines of heading 8444. Falls under HTS 8448.20.50.90 as parts suitable solely for wafer preparation in semiconductor manufacturing.
Duty Rate — China → United States
20.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Provide detailed wafer thickness specifications (typically 100-775 microns) to confirm semiconductor use
• Include boule diameter compatibility data matching heading 8444 equipment standards
• Avoid common pitfall of classifying as general cutting tools under 8461