8448.20.50.90/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Double-sided lapping equipment that achieves semiconductor wafer flatness within 0.5 microns for fabrication readiness, serving as auxiliary machinery for heading 8444 wafer processing lines under HTS 8448.20.50.90.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Document total thickness variation (TTV) specifications proving semiconductor tolerances

• Include process flow diagrams showing integration with heading 8444 equipment

• Avoid reclassification as general lapping machines under 8460.40