8448.20.50.90/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Double-sided lapping equipment that achieves semiconductor wafer flatness within 0.5 microns for fabrication readiness, serving as auxiliary machinery for heading 8444 wafer processing lines under HTS 8448.20.50.90.

Duty Rate — Japan → United States

13.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document total thickness variation (TTV) specifications proving semiconductor tolerances

• Include process flow diagrams showing integration with heading 8444 equipment

• Avoid reclassification as general lapping machines under 8460.40

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8448.20.50.90