Wafer Lapping Machine from Germany
Double-sided lapping equipment that achieves semiconductor wafer flatness within 0.5 microns for fabrication readiness, serving as auxiliary machinery for heading 8444 wafer processing lines under HTS 8448.20.50.90.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document total thickness variation (TTV) specifications proving semiconductor tolerances
• Include process flow diagrams showing integration with heading 8444 equipment
• Avoid reclassification as general lapping machines under 8460.40