Wafer Lapping Machine from China
Double-sided lapping equipment that achieves semiconductor wafer flatness within 0.5 microns for fabrication readiness, serving as auxiliary machinery for heading 8444 wafer processing lines under HTS 8448.20.50.90.
Duty Rate — China → United States
20.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document total thickness variation (TTV) specifications proving semiconductor tolerances
• Include process flow diagrams showing integration with heading 8444 equipment
• Avoid reclassification as general lapping machines under 8460.40