</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8448.20.50.90/Wafer Edge Profiling Tool/Mexico

Wafer Edge Profiling Tool from Mexico

Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.

Duty Rate — Mexico → United States

13.3%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify edge profiles (laser diced, mechanical grind) supported by the tool

• Include wafer handling specifications (200mm-450mm diameters)

Wafer Edge Profiling Tool from Mexico — Import Duty Rate | HTS 8448.20.50.90