8448.20.50.90/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify edge profiles (laser diced, mechanical grind) supported by the tool

• Include wafer handling specifications (200mm-450mm diameters)