8448.20.50.90/Wafer Edge Profiling Tool/Germany

Wafer Edge Profiling Tool from Germany

Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.

Duty Rate — Germany → United States

13.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify edge profiles (laser diced, mechanical grind) supported by the tool

• Include wafer handling specifications (200mm-450mm diameters)