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8448.20.50.90/Wafer Edge Profiling Tool/Germany

Wafer Edge Profiling Tool from Germany

Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify edge profiles (laser diced, mechanical grind) supported by the tool

• Include wafer handling specifications (200mm-450mm diameters)

Wafer Edge Profiling Tool from Germany — Import Duty Rate | HTS 8448.20.50.90