Wafer Edge Profiling Tool from Germany
Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profiles (laser diced, mechanical grind) supported by the tool
• Include wafer handling specifications (200mm-450mm diameters)