Wafer Edge Profiling Tool from China
Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.
Duty Rate — China → United States
23.3%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify edge profiles (laser diced, mechanical grind) supported by the tool
• Include wafer handling specifications (200mm-450mm diameters)