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8448.20.50.90/Wafer Edge Profiling Tool/Canada

Wafer Edge Profiling Tool from Canada

Precision edge grinding attachment for semiconductor wafers preventing chipping during handling, auxiliary to heading 8444 wafer processing equipment under HTS 8448.20.50.90.

Duty Rate — Canada → United States

13.3%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify edge profiles (laser diced, mechanical grind) supported by the tool

• Include wafer handling specifications (200mm-450mm diameters)