8448.20.50.90/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Chemical mechanical planarization (CMP) polisher for final semiconductor wafer surface preparation, achieving sub-nanometer roughness. Classified HTS 8448.20.50.90 as auxiliary for heading 8444 wafer fabrication preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify polishing pad materials and slurry compatibility confirming semiconductor use

• Provide surface roughness specifications (Ra < 0.2nm) for classification

• Document cleanroom compatibility (Class 1) requirements