Semiconductor Wafer Polisher from Japan
Chemical mechanical planarization (CMP) polisher for final semiconductor wafer surface preparation, achieving sub-nanometer roughness. Classified HTS 8448.20.50.90 as auxiliary for heading 8444 wafer fabrication preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify polishing pad materials and slurry compatibility confirming semiconductor use
• Provide surface roughness specifications (Ra < 0.2nm) for classification
• Document cleanroom compatibility (Class 1) requirements