8448.20.50.90/Semiconductor Wafer Polisher/Canada

Semiconductor Wafer Polisher from Canada

Chemical mechanical planarization (CMP) polisher for final semiconductor wafer surface preparation, achieving sub-nanometer roughness. Classified HTS 8448.20.50.90 as auxiliary for heading 8444 wafer fabrication preparation equipment.

Duty Rate — Canada → United States

13.3%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada

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Import Tips

• Specify polishing pad materials and slurry compatibility confirming semiconductor use

• Provide surface roughness specifications (Ra < 0.2nm) for classification

• Document cleanroom compatibility (Class 1) requirements