8448.20.50.90/Semiconductor Wafer Grinder/Japan

Semiconductor Wafer Grinder from Japan

Automatic wafer grinder that processes sliced wafers to precise diameter and flatness specifications for semiconductor fabrication, classified as auxiliary machinery under HTS 8448.20.50.90 for heading 8444 equipment. Critical for achieving wafer tolerances of ±1 micron.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit engineering drawings showing semiconductor-specific features like vacuum chucks

• Document flatness specifications (typically <1 micron across 300mm wafers) for classification support

• Confirm exclusion from Chapter 90 by verifying primary grinding vs testing function