Semiconductor Wafer Grinder from Japan
Automatic wafer grinder that processes sliced wafers to precise diameter and flatness specifications for semiconductor fabrication, classified as auxiliary machinery under HTS 8448.20.50.90 for heading 8444 equipment. Critical for achieving wafer tolerances of ±1 micron.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit engineering drawings showing semiconductor-specific features like vacuum chucks
• Document flatness specifications (typically <1 micron across 300mm wafers) for classification support
• Confirm exclusion from Chapter 90 by verifying primary grinding vs testing function